q?v~zy??q?v?_rb]???qcabbq HFS840 2 1 3 bv dss = 500 v r ds(on) typ
i d = 9.0 a ? originative new design ? superior avalanche rugged technology ? robust gate oxide technology ? very low intrinsic capacitances ? excellent switching characteristics ? unrivalled gate charge : 25 nc (typ.) ? extended safe operating area ? lower r ds(on)
7 \ s # 9 gs =10v ? 100% avalanche tested thermal resistance characteristics features absolute maximum ratings t c =25 e unless otherwise specified HFS840 500v n-channel mosfet symbol parameter value units v dss drain-source voltage 500 v i d drain current ? continuous (t c = 25 zq 9.0* a drain current ? continuous (t c = 100 zq 5.4* a i dm drain current ? pulsed (note 1) 36* a v gs gate-source voltage daq v e as single pulsed avalanche energy (note 2) 360 mj i ar avalanche current (note 1) 9.0 a e ar repetitive avalanche energy (note 1) 13.5 mj dv/dt peak diode recovery dv/dt (note 3) 4.5 v/ns p d power dissipation (t c = 25 zq qqqqqqqqqqqqqqqqqqqqqqqqqqq^qu???q????qcfq 44 w 0.35 w/ q t j , t stg operating and storage temperature range -55 to +150 q t l maximum lead temperature for soldering purposes, 1/8? from case for 5 seconds 300 q symbol parameter typ. max. units r jc junction-to-case -- 2.86 `?q r ja junction-to-ambient -- 62.5 sep 2011 to-220f 1.gate 2. drain 3. source * drain current limited by maximum junction temperature
q?v~zy??q?v?_rb]???qcabbq HFS840 notes ; 1. repetitive rating : pulse width limited by maximum junction temperature 2. l=8mh, i as =9.0a, v dd =50v, r g =25 : , starting t j =25 q c 3. i sd ? $ g l g w ? $ v 9 dd ? % 9 dss , starting t j =25 q c 4. pulse test : pulse width ? v ' x w \ & |